Don’t blink. Operating at the world’s fastest SO-DIMM memory frequency (2666MHz), HyperX® Impact memory opens up a world of detail other gamers will never know: the hairs on the back of your victim’s neck, for instance. It automatically recognizes the platform it’s plugged into and auto overclocks to the highest memory frequency published (up to 2400MHz) with no need to adjust system BIOS settings. So you get extreme performance that supports notebooks and other small form factor systems using either AMD or the latest Intel CPU technologies with no hassle at all. And all you’ll ever miss is lag.
Impact makes your game hotter while keeping your system cool. It has low voltage settings at 1.35V for less power consumption, reduced heat generation and quiet computing. Its slim, sleek new look lets you stand out in the crowd while the thin thermal label allows for installation in slim or ultra-slim notebooks.
Best of all, HyperX Impact delivers high performance at a low cost. It's gamer-approved and backed by a lifetime warranty, free technical support and legendary liability.
Kingston Impact DRAM From HyperX, A Leader in eSports
HyperX supports some of the best gaming teams in the world. While you might not be a pro yet, you can certainly game with the same equipment they do.
Free Technical Support
When you spend that much time building your ideal system, make sure your memory lasts. With HyperX memory you get free technical support to help you out if you're in a tight spot.
JEDEC standard 1.35V (1.28V ~ 1.45V) and 1.5V (1.425V ~
1.575V) Power Supply
VDDQ = 1.35V (1.28V ~ 1.45V) and 1.5V (1.425V ~ 1.575V)
800MHz fCK for 1600Mb/sec/pin
8 independent internal bank
Programmable CAS Latency: 11, 10, 9, 8, 7, 6
Programmable Additive Latency: 0, CL - 2, or CL - 1 clock
Burst Length: 8 (Interleave without any limit, sequential with
starting address “000” only), 4 with tCCD = 4 which does not
allow seamless read or write [either on the fly using A12 or
Bi-directional Differential Data Strobe
Internal(self) calibration : Internal self calibration through ZQ
pin (RZQ : 240 ohm ± 1%)
On Die Termination using ODT pin
Average Refresh Period 7.8us at lower than TCASE 85°C,
3.9us at 85°C < TCASE < 95°C
PCB : Height 1.180” (30.00mm), double sided component